Latest Information
April 29, 2009 at 2:49 PM
Uniscan Instruments announce a new addition to their series of Technical Sales Supplements
A new Technical Sales Supplement (TSS #09) has been published to demonstrate the use of topographic measurements in conjunction with scanning electrochemical microscopy for corrosion applications.
The importance of scanning electrochemical microscopy (SECM) to corrosion applications is of growing interest to both scientific and commercial sectors. SECM’s high resolution capabilities coupled with its quantitative analytical capabilities provide a novel method to interrogate and image a surface’s corrosion resistance. The combination of the Optical-Surface Profiling (OSP) technique with the SECM allows a user to take a measure of the surface features and relieve the SECM probe’s position during the scan. With the addition of Height-Tracking it is possible to effectively remove the effects of topology resulting in an unbiased measure of the electrochemical activity.
The TSS entitled “OSP-SECM Height Relief. Application: Corrosion” is available from Uniscan Instruments.
